期刊論文( Journal )

1. Wen-Hsi LEE, Ching-Chieh WANG, Wei-Ting CHEN, and Jia-Chuong HO, Japanese Journal of Applied Physics, Vol. 47, No. 12, 2008, (Received June 10, 2008; accepted September 6, 2008)
2. Wen-Hsi Lee, C. C. Wang, and J. C. Ho, J. Vac. Sci. Technol. B 27(2), Mar/Apr 2009,(Received 6 June 2008; accepted 9 February 2009)
3. Wen-Hsi Lee, J.J. Wang, J.C. Ho, Thin Solid Film, in press
4. Wen-Hsi Lee , C.C. Wang, Journal of Nanoscience and Nanotechnology, in press
5. Wen-Hsi Lee and C.C. Wang, J. Vac. Sci. Technol. B, in press
6. Hu SY, Hung CC, Lee WH, et al. “Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process ,”THIN SOLID FILMS. (Published: DEC 1 ,2008)
7. Wang JJ, Lee WH, Ho JC, et al. “High performance OTFTs using surface-modified nanocomposite dielectric gate insulator ,”JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS . (Accepted: 29 January 2008 Published online:23
8. Lee WH, Wang CC, Chen WT, et al. “Characteristic of Organic Thin Film Transistor with a High-k Insulator of Nano-TiO2 and Polyimide Blend,”JAPANESE JOURNAL OF APPLIED PHYSICS .(accepted September 6, 2008 ,published online December
9. Lee WH, Su CY, Chen YS “A Study on Bandwidth Enhancement of 900/1800 Dual Band LTCC Chip Antenna by Using Equivalent Circuit Analysis,”INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING .(Accepted: 9 March, 2008,Pub
10. Hung CC,Lee WH, Chang SC, et al. “Investigation of copper scratches and void defects after chemical mechanical polishing,”JAPANESE JOURNAL OF APPLIED PHYSICS . (accepted April 10, 2008 ; published online September 12, 2008)
11. Hung CC, Lee WH, Wang YL, et al. “Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy,”JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A.(Published: SEP 2008)
12. Su CY, Huang CL, Lee WH “Phase development and dielectric properties of BaAl2Si2O8-based low temperature co-fire ceramic material,”JOURNAL OF THE CERAMIC SOCIETY OF JAPAN .(Published: SEP 2008)
13. Lee WH, Chen WT, Lee YC “Performance enhancement of ZnO-based multilayer varistor by constrained sintering,”JOURNAL OF THE AMERICAN CERAMIC SOCIETY.(approved May 27, 2008,Published: SEP 2008)
14. Hung CC, Lee WH, Wang YL “Investigation of slurry chemical corrosion on TaN barriers with plasma treatment,”JOURNAL OF THE ELECTROCHEMICAL SOCIETY.(Published: 2008)
15. Hung CC, Wang YL, Lee WH, et al. “Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating,”JOURNAL OF THE ELECTROCHEMICAL SOCIETY.(published 18 July 2008)
16. Wang YS, Hung CC, Lee WH, et al. “Under-layer behavior study of low resistance Ta/TaNx barrier film,”THIN SOLID FILMS. (Published: JUN 30 2008)
17. Hung CC, Wang YL, Lee WH, et al. “Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry,”JOURNAL OF THE ELECTROCHEMICAL SOCIETY.(revised 11 February 2008,Published: 2008)
18. Hung CC, Lee WH, Wang YS, et al. “Measurement techniques of sheet resistance on copper defects after chemical mechanical polishing,”JAPANESE JOURNAL OF APPLIED PHYSICS.(accepted November 15, 2007; published online February 15, 2008)
19. Hung CC, Lee WH, Hu SY, et al. “Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy,” JOURNAL OF THE ELECTROCHEMICAL SOCIETY (revised 2 January 2008; pu
20. Hsing I. Hsiang, Kai H. Chuang, Wen H. Lee"Fesicr alloy powder to carbonyl iron powder mixing ratio effects on the magnetic properties of the iron-based alloy powder cores prepared using screen printing"
21. Kai Jyun Jhong, Tsung Wei Chang, Wen Hsi Lee, Mi Ching Tsai, I. Hua Jiang"Characteristic of high frequency Fe-Si-Cr material for motor application by selective laser melting"
22. Tai Chen Kuo, Kai Jyun Jhong, Chia Wei Lin, Wen Hsi Lee"Effect of annealing conditions on dopants activation and stress conservation in silicon-germanium"
23. K. C. Chung, Wen Hsi Lee"Effect of pretreatment on Al2O3 substrate by depositing Al2O3 film on the properties of Ni–Cr–Si based thin film resistor"
24. Tzu Yi Hung, Jessica An Chieh Liu, Wen Hsiu Lee, Jie Ren Li"Hierarchical Nanoparticle Assemblies Formed via One-Step Catalytic Stamp Pattern Transfer"
25. Tai Chen Kuo, Tzu Lang Shih, Yin Hsien Su, Wen Hsi Lee, Michael Ira Current, Seiji Samukawa"Neutral beam and ICP etching of HKMG MOS capacitors: Observations and a plasma-induced damage model"
26. Tai Kung Lee, Chen Su Chiang, Wen Hsi Lee"A study on Cu particles coated with nano-silver by a replacement reaction between silver nitrate and copper particles"
27. Kosuke Tsuji, Wei Ting Chen, Hanzheng Guo, Wen Hsi Lee, Sophie Guillemet-Fritsch, Clive A. Randall"Contrasting conduction mechanisms of two internal barrier layer capacitors: (Mn, Nb)-doped SrTiO3 and CaCu3Ti4O12"
28. Yi Lung Cheng, Chih Yen Lee, Yao Liang Huang, Chung Ren Sun, Wen Hsi Lee, Giin Shan Chen, Jau Shiung Fang, Bach Thang Phan"Cu-Induced Dielectric Breakdown of Porous Low-Dielectric-Constant Film"
29. Tzu Lang Shih, Yin Hsien Su, Tai Chen Kuo, Wen Hsi Lee, Michael Ira Current"Effect of microwave annealing on electrical characteristics of TiN/Al/TiN/HfO2/Si MOS capacitors"
30. Yin Hsien Su, Tai Chen Kuo, Wen Hsi Lee, Yu Sheng Wang, Chi Cheng Hung, Wei Hsiang Tseng, Kuo Hsiu Wei, Ying Lang Wang"Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials"
31. Wen Hsi Lee, Tsung Wei Chang, Yin Hsien Su"Effects of annealing pressure on microstructure and conversion efficiency for electrodeposited CuInSe2 absorbers"
32. Tai Kuang Lee, Chao Te Liuand, Wen Hsi Lee"Fabrication of In0.75Zn1.5Sn1.0 (IZTO) thin-film transistors using solution-processable materials and PZT inkjet-printing"
33. Tai Chen Kuo, Yin Hsien Su, Wen Hsi Lee, Wei Hsiang Liao, Yu Sheng Wang, Chi Cheng Hung, Ying Lang Wang"A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization"
34. Yi Lung Cheng, Kai Chieh Kao, Giin Shan Chen, Jau Shiung Fang, Chung Ren Sun, Wen Hsi Lee"Effect of annealing temperature on electrical and reliability characteristics of HfO2/porous low-k dielectric stacks"
35. Yi Lung Cheng, Chiao Wei Haung, Wei Jie Hung, Chung Ren Sun, Wen Hsi Lee"Effect of H2/He plasma treatment on porous low dielectric constant materials"

會議論文( Conference )

1. W.S.Lee, W.T. Chen, J.J.Wang and Y.B.Kuo,” High-K hybrid organic- inorganic insulator for organic thin-film transistor application,”Proceeding of 2005 Annual Conference of the Chinese Society for Materials Science, Nov. 26, 2005, Taipei (oral presentation).
2. Yu-Sheng Wang, Wen-Hsi Lee, Ying-Lang Wang, and Shih-Chieh Chang,” Ta/TaNx barrier film electrical character correlation with plasma,” Proceeding of the 2nd International Symposium on Point Defect and Nonstoichiometry. Oct 4-6 2005 Kaohsiung (參考作8)
3. Chi-Cheng Hung, Wen-Hsi Lee, Shih-Chieh Chang and Ying-Lang Wang, ,” Investigation of copper scratch and void defects after chemical mechanical polishing,” Proceeding of the 2nd International Symposium on Point Defect and Nonstoichiometry. Oct 4-6 2005 Kaohsiung(參考作9)
4. Y.Z.Chang, W.S.Lee , H.I.Wu and C.Y.Su: “Miniaturizing the Size of Microwave Filter by Using LTCC Technology with Hybrid Dielectrics” APMC(2005) Proceedings(參考作10)
5. W.H.Lee, J. Yang, T.Yang, C.Y.Su, Y.C.Lee and C.L.Hu: “Ultra High Q NPO MLCC with Ag Inner Electrode for Telecommunication Application” International Conference in Asia (IUMRS-ICA2004), Nov. 17, 2004, Hsinchu (oral presentation).(參考作11)
6. Y.S.Chen, W.S.Lee , Y.C.Lee, S.P.Lin and C.T.Lee: “Using LTCC Technology with High K Dielectric to Make a Compact Helix Chip Antenna for 900/1800-MHz Cellular Systems” 2004 Internation Conference on Electromagnetic Applications and Compatibility (ICEMAC 2004),Oct. 14, 2004 (oral presentation).( 參考作12)
7. W.S.Lee ,D.Hennings and T.Y.Tseng” Effects of Calcination Temperature and A/B Ratio on Dispersion of Aqueous (Ba,Ca)(Ti,Zr,Mn)O3 Suspension for Ni-based Multilayer Ceramic Capacitors “ The 100th Annual Meeting of the American Ceramic Society, Cincinnati,OH,May1-4, 1998
8. W.S.Lee and T.Y.Tseng,”Comparison of Performance and Technology for Base Metal Endtermination of Multilayer Ceramic capacitor with Ni-Inner Electrode “ The 12th European Passive Components Symposium , CARTS-EUROPE’98 Nice France, Oct 13-16,1998
9. W.S.Lee and T.Y.Tseng,”Comparison of Performance and Technology for Base Metal Endtermination of Multilayer Ceramic capacitor with Ni-Inner Electrode “ The 12th European Passive Components Symposium , CARTS-EUROPE’98 Nice France, Oct 13-16,1998
10. W.S.Lee ” Effect of Dy-Doping on Resistance Degradation of Multilayer Ceramic Capacitors with Ni Electrodes under the Highly Accelerated Life Test “ The 102th Annual Meeting of the American Ceramic Society, St. Louis, Missouri, Apri 30-May3,, 2000
11. W.S.Lee” Development of a Multilayer Ceramic Antenna for Bluetooth Application Using LTCC” 14th European Passive Components Symposium , CARTS-EUROPE 2000, Oct 16-20,2000
12. R.Derksen, K.Kunth, W.S.Lee,” A New Testing Method of Ceramic Multilayer Capacitor with Ultrathin Dielectric Layers” 14th European Passive Components Symposium , CARTS-EUROPE 2000, Oct 16-20,2000
13. W.S.Lee “Harmonic Suppresion of a bandpass LC filter using LTCC technology ” 1st Ceramic Applications for Microwave and Photonic Packaging “ The Westin Providence, Rhode Island May 01-02, 2002
14. W.S.Lee , D.Hennings,W.A.Groen,W.Weber and R.Waser,”Investigation of Dyprosium Doping Ba(Ti,Zr)O3 Sintered in Reducing Atmosphere “ The 1999 Annual Conference of The Chinese Society for Material Science, HsinChu, Taiwan, Nov 25-26, 1999
15. 鄭景太, 方友清, 簡朝和, 李文熙” 添加 MnO, Ho2O3 及玻璃對 BaTiO3 之介電性質的影響 “ The 1999 Annual Conference of The Chinese Society for Material Science, HsinChu, Taiwan, Nov 25-26, 1999
16. W.S.Lee and Y.C.Lee ” Effect of Glass Transition Temperature(Tg) Adjusting by Acrylic Emulsion Binder Blends on Tape Performance” 2000 Annual Conference of The Chinese Society for Polymer, Kaoshiung, Taiwan ,Jan. 21-23, 2000
17. C.H.Kao and W.S.Lee, ”The Influence of Dispersant on the PVA Behaviour in Boronsilicate Ceramic ” 2001 Annual Conference of The Chinese Society for Polymer, Kaushiung, Taiwan ,Jan. 05-06, 2001
18. W.S.Lee , K.C.Huang ,”Influence of processing parameters of sputter on electric properties of thin film resistor “ The 2000 Annual Conference of The Chinese Society for Material Science, HsinChu, Taiwan, Nov 24-25, 2000
19. W.S.Lee , C.T.Lee and B.S.Chiu,”The effect of glass addition on the microwave dielectric properties of (Mg,Ca)TiO3 “ The 2000 Annual Conference of The Chinese Society for Material Science, HsinChu, Taiwan, Nov 24-25, 2000
20. W.S.Lee, H. Chen and C.W.Tang, “High Performance Packing with Multilayer Ceramic Antenna Switch Module for Wireless Communication” The 4th International Symposium on Electronic Material and Packaging Kaohsiung, Taiwan R.O.C. (2002)
21. T. Chang, J. K. Jyun, W. Lee, M. Tsai, C. Cheng"High content Nd-Fe-B in polymer composite by fused depo-sition Modeling"
22. Tai Chen Kuo, Chao Yi Lin, Wen Hsi Lee, Ger Pin Lin, Shao Yu Hu, Steve Walther, Yi Hsiang Su, Sandeep Mehta"High Dopant Activation of Boron in SiGe with two-step Implantation and Microwave Annealing"
23. Guan Min Tseng, Kai Jyun Jhong, Mi Ching Tsai, Po Wei Huang, Wen Hsi Lee"Application of additive manufacturing for low torque ripple of 6/4 switched reluctance motor"
24. Wen Hsi Lee, Tzu Lang Shih, Chia Wei Lin, Yi Chen Chung"Activation of high concentrations of phosphorus in germanium by two-steps microwave annealing"
25. Guan Min Tseng, Mi Ching Tsai, Po Wei Huang, Wen Hsi Lee"A radially inserted permanent-magnet magnetic coupling design based on 3D printing"
26. Tai Chen Kuo, Yin Hsien Su, Wen Hsi Lee, Wei Hsiang Liao, Yu Sheng Wang, Chi Cheng Hung, Ying Lang Wang"A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization"
27. Yi Lung Cheng, Yao Liang Huang, Chung Ren Sun, Wen Hsi Lee, Giin Shan Chen, Jau Shiung Fang"Effect of Cu drift on dielectric breakdown for porous low dielectric constant film under static and dynamic stress"
28. Yi Lung Cheng, Chiao Wei Huang, Chung Ren Sun, Wen Hsi Lee"Effects of precursor flow rates on characteristics of low-k SiOC(H) film deposited by plasma-enhanced chemical vapor deposition"
29. Kai Jyun Jhong, Wen Hsi Lee"Fabricating soft maganetic composite by using selective laser sintering"
30. T. L. Shih, W. H. Lee"High dopant activation and diffusion suppression of phosphorus in Ge crystal with high-temperature implantation by two-step microwave annealing"
31. Yin Hsien Su, Tai Chen Kuo, Wen Hsi Lee, Yao Ren Lee"Investigation of high-k/metal gate MOS capacitors annealed by microwave annealing as a post-metal annealing process"
32. Tai Chen Kuo, Tzu Lang Shih, Yin Hsien Su, Wen Hsi Lee, Wei Hsiang Liao"Investigation the plating and wetting ability of reactive sputtered Molybdenum-Tungsten multi-layers for advanced Cu metallization"
33. Zhi Yong Zhang, Kai Jyun Jhong, Chung Wei Cheng, Po Wei Huang, Mi Ching Tsai, Wen Hsi Lee"Metal 3D printing of synchronous reluctance motor"
34. Yin Hsien Su, Jia Nan Shih, Yu Sheng Wang, Wei Hsiang Tseng, Wei Hsiang Liao, Chun Yi Hung, Wen Hsi Lee, Ying Lang Wang"CoW alloy as multi-function diffusion barrier material for next-generation Cu metallization"
35. Che Lung Lee, Wen-Shi Lee, Cheng Hsien Yang"Co-sensitization effect of orgnic/inorganic dyestuffs in dye-sensitized photovoltaic cells"
36. Tsung Wei Chang, Wen Hsi Lee"Improvement of electrodeposition on flexible substrates for CuInSe 2 solar cells"
37. Chen Su Chiang, Wen Hsi Lee, Franco Jap"Investigation into microstructural and electrical characteristics of Ni-Cr-Si thin-film resistors deposited in Al2O3 substrate using DC and RF magnetron sputtering"
38. Tzu Lang Shih, Wen Hsi Lee"Optimization of Parameters for TVS breakdown voltage: Design and Fabrication"
39. Tzu Lang Shih, Chih Chuan Chang, Wen-Shi Lee"Parameter optimization of PT-IGBT breakdown voltage"
40. Wen Hsi Lee, Ming Han Tsai, Wei Hsiang Liao"Studies on ultra shallow junction 20nm P-MOS with 250°C microwave annealing for activation of boron dopants in silicon"
41. Che Lung Lee, Wen-Shi Lee, Cheng Hsien Yang"Triazoloisoquinoline based co-adsorbent in dye-sensitized photovoltaic cells"
42. Tsung Wei Chang, Wen Hsi Lee, Yin Hsien Su"Effects of annealing pressure for electrodeposited CuInSe2 solar sell"
43. Tzu Lang Shih, Sheng Wen Chen, Chang Peng Wu, Chung Wei Cheng, Chih Wei Chien, Wen-Shi Lee"USJ formation using solid phase epitaxial regrowth and femtosencond laser anneal"
44. S. Y. Hu, W. H. Lee, Y. H. Su"Characterization of single bath electrodeposited Cu 2ZnSnSe 4 thin films"
45. Che Lung Lee, Wen-Shi Lee, Cheng Hsien Yang, Hao Hsun Yang"Reduction of collection efficiency of charge carriers with increasing cell size in dye-sensitized solar cell"
46. Ying Chieh Lee, Yen Lin Huang, Wen-Shi Lee, Bao Hsing Chen, Fuh Sheng Shieu"Microstructure and phase transformation of zinc titanate thin films"
47. Ying Chieh Lee, Hui Hsiang Huang, Wen Hsi Lee, Yen Lin Huang, Shih Feng Chien"Microwave dielectric properties of Nb2O3-Zn 0.95Mg0.05TiO3+0.25TiO2 ceramics with Bi2O3 addition"
48. Wen Hsi Lee, Chun Chieh Wang, J. C. Ho"Application of chemical-mechanical polishing for planarizing a high-K nano-composite polyimide insulator used in organic thin film transistors"
49. Wen Hsi Lee, J. J. Wang, W. T. Chen, J. C. Ho, T. Hu"High performance OTFT with a hybrid nanocomposite insulator"
50. Ching Wen Tang, Wen Hsi Lee, Hsin Yin Yao, Wen Long Leu, Chi Yang Chang"Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports"
51. Wen His Lee, H. Chen, C. W. Tang, J. S. Hsieh, C. Y. Su, R. Lei"High performance packaging with multilayer ceramic antenna switch module for wireless communication"

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5. 台灣陶業學會陶業獎章(台灣陶業學會)(2023)
6. 第8屆經濟部國家產業創新獎(經濟部)(2023)
7. 指導張書維博士班學生榮獲2023 TSIA 半導體獎(台灣半導體產業協會)(2023)
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9. 台灣陶業學會服務獎(台灣陶業學會)(2022)
10. 指導學生甘佳鑫碩士班學生榮獲110台灣陶業年會論文競賽碩士組第三名(台灣陶業學會)(2021)
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12. 產學優良獎(國立成功大學)(2021)
13. 指導張書維博士班學生榮獲台積電2020 博士獎學金250萬(台積電)(2020)
14. 高效率低成本矽基正銅電極太陽能(東元科技)(2019)
15. 可空氣燒銅膏應用於矽基太陽能正電極材料開發＂榮獲產學績優獎(科技部)(2018)
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1. 112學年度教育部補助大學校院產學合作培育博士級研發人才計畫-被動元件前瞻技術博士專班(2023-08-01→ 2024-07-31)
2. 南部科學園區新興科技應用計畫-永續低碳排軟性電路板加法銅導線捲對捲量產設備開發與產品特性驗證(2024-03-01→ 2025-04-30)
3. 「李國鼎」科技獎座孳息-台達電子工業(股)公司與本校教師產學研發計畫-新世代積層電容器-高可靠度可空氣燒結高熵合金電極MLCC與固態鋁質電容器(2024-03-01→ 2025-04-30)
4. 一種環保碳中和軟板銅導線加法製程研究(2023-08-01→ 2024-07-31)
5. 可空氣中燒結之非貴金屬導體與合金技術商業化計畫(2021-11-01→ 2024-06-30)
6. 高效率旋轉式ALD製程應用於奈米半導體氧化物薄膜(2/2)(2022-11-01→ 2024-03-31)
7. 高效率旋轉式ALD製程應用於奈米半導體氧化物薄膜(1/2)(2021-11-01→ 2022-10-31)
8. 大面積高品質二維材料MoTe2元件膜層及電性分析(2022-08-01→ 2023-07-31)
9. 氮氣燒結銅錳與鎳鉻合金厚膜印刷材料研究( 2022-08-01 → 2023-07-31)
10. 產學研發中心計畫—前瞻被動元件技術研發中心(2020-07-01 → 2023-06-30)
11. 科研創業計畫：晶片電阻卑金屬商業化個案-( 2022-01-01 → 2022-12-31)
12. 車用電子厚膜印刷智能材料產業創新服務技術開發計畫(2019-08-01 → 2022/07/31)
13. 正銅電極應用矽基太陽能電池( 2020-08-01 → 2021-07-31)
14. 300mm變頻微波退火應用閘極全環鰭式場效電晶體之研發(2/2)(2020-01-01 → 2020-12-31)
15. 300mm變頻微波退火應用閘極全環鰭式場效電晶體之研發(1/2)(2019-01-01 → 2019-12-31)
16. 低歐姆晶片電阻器卑金屬化技術開發(2017-06-01 → 2018-05-31)
17. 利用微波退火方式降低新一代半導體材料N型鍺S/D阻值之研究(2017-08-01 → 2018-07-31)
18. 超低溫燒結正銅電極應用於高效率矽基太陽能電池(2016-01-01 → 2016-12-31)
19. 厚膜印刷式負溫度係數熱敏電阻材料開發(2015-11-01 → 2016-10-31)
20. 中性原子束蝕刻技術在次二十奈米積體電路製程之應用(I)(2014-08-01 → 2015-07-31)
21. 環保型高功能壓電揚聲器開發(2/2)(2014-02-01 → 2015-01-31)
22. 高效率低成本矽基太陽能導電銅膏開發(2014-01-01 → 2014-12-31)
23. 環保型高功能壓電揚聲器開發(1/2)(2013-02-01 → 2014-01-31)
24. 以電化學蝕刻提升CIGS太陽能電池之光電轉換效率和生產良率(2013-01-01 → 2013-12-31)
25. 應用於半導體新阻障層材料與製程研究(II)(2012-08-01 → 2013-07-31)
26. 積層壓電複合材料喇叭開發(2011-11-01 → 2012-10-31)
27. 應用於半導體新阻障層材料與製程研究(2011-08-01 → 2012-07-31)
28. 應用於太陽能電池之熱電元件開發(I)(2010-01-01 → 2010-12-31)
29. 以電化學沉積製程製備銅銦硒太陽電池之研究(2010-07-01 → 2011-02-28)
30. 應用噴墨印刷研製薄膜電晶體與互補式金屬氧化層半導體元件(2010-08-01 → 2011-07-31)
31. 環保型無鉛壓電喇叭研究(2010-11-01 →2011-10-31)
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33. 有機薄膜電晶體材料研究與元件製作-主動層五苯環高(u)移動率與傳導機制研究(2008-08-01 → 2009-07-31)
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35. 應用於高功率發光二極體散熱基板製作開發(2008-08-01 → 2009-07-31)
36. 有機薄膜電晶體材料研究與元件製作(2007-08-01 → 2008-07-31)
37. 小型化GPS 陶瓷平板天線微波材料開發與元件製作(2006-11-01 → 2007-10-31)
38. 利用混合異質介質材料設計與製作積層微波濾波器/雙功器(II)(2006-08-01 → 2007-07-31)
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40. 應用於內埋PCB高介電常數有機無機複合材料開發(2005-11-01 → 2006-10-31)
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